Acting 1950, carMakeThe electron that uses inProductStill do not arriveMakeTotalCost1% . Nowadays, electronProductCost35% what can have amounted to totle drilling cost, and predict will increase to 50% to 2030. The rapid growth of product of automobile industry electron is main by the following 4 respectsDrive: . The system is monitored and control (mixture power of electronic fuel eject, gas electricity) . SafeSystem (prevent dead lock firmly fasten a load, SafeGasbag wait) . Advanced drive support system (deviate driveway warning, jockey auxiliary, scotoma monitoring, get used to cruise oneself control) . Drive a vehicle facilitates (recreation of satellitic navigation, message)

Semiconductor component is the core of the electronic product assembly in the car, according to automobile factory business and model different, contemporary car may need to amount to 8, 000 chip, and this number is met only as drive to gain ground and increase of the car independently, additional electronic subsystem and the integrated circuit that its use will drive for nobody the sensor that the car offers its place to need, radar and artificial intelligence.

Year of crop of car and light-duty lorry be 8, many 800, every Che Zhongan assembles product of thousands of chip, the influence of manufacturing industry of conductor of automobile industry half-and-half has begun to show. Thousands of chip that a simple fact uses in the car namely can not be out of order.

Of car semiconductor spare partsDependabilityCrucial, any is in in car travel process the chip of occurrence breakdown is brought about possibly guarantee costlily maintenance and product recall, and may damage the brand image of car manufacturer, person harm may be brought about to endanger life even below extreme circumstance.

If there is 5 in an average car, 000 chip, car manufacturer everydayProduction25 thousand cars, so even if 1/1000000 (fault rate also can bring about the chip of Ppm) to because,exceed 125 cars everyday chipQualityAppearDependabilityProblem.

Because semiconductor is car manufacturer breakdown,arrange the first issue in the graph, the car system supplier of one class asks now semiconductorQualityCan achieve billion 1/0 (the level of Ppb) , and no matter,current trend is chip amount how many, more and more suppliers begin demarcate ” the breakdown amount that allows at most ” .

The method that discovers dependability fault at present is excessive rely onTestWith ageing tests, the result is quality target cannot come true and go very far. In the meantime, AuditThe standard has challenge sex more and more, the fountainhead that drives brilliant round factory to be made in chip discovers these dependability problems, because discover a problem at this moment,take the cost that corrects measure most cheap. Should enter this constant growthThe marketDomain, maintain simply perhapsThe marketHave rate, integrated circuit manufacturer must answer this kind of change that asks to chip dependability actively.

Fortunately, to semiconductor manufacturer, the thing height with the dependability of chip and their hep place is relevant: Random blemish.

In fact, good to the designMake ChengWith the product character, inchoate chip dependability problem (explicit dependability) give priority to with random blemish. Killer blemish (influenceFine rateblemish) it is to bring about package to be in time T=0(is finalTest) unsuccessful blemish. Potential defect (the blemish that affects chip reliability) it is to bring about package to be in T>0(after ageing) malfunctioning blemish.

Discover killer blemish (Fine rate) with potential defect (dependability) the relation between is to pass the same defect type that observes influence fine is led to also affect reliability. The size of blemish and they are in this both and main basis packageStructureThe position that appears on will distinguish. Graph the 1 case that showed the killer that brings about open circuit and short circuit and potential defect.

Graph the same defect type that 1 influence fine leads also can affect reliability. Basically be in according to the size of blemish and them designStructureThe position that go up will distinguish.
The relation between fine rate and dependability blemish not bureau be confined to a few specific blemish types; Any likelihoods bring about fine to lead losing blemish type to cause dependability problem possibly also. Breakdown analysis makes clear, in fact most dependability blemish isMake ChengRelevant blemish, can trace to the source brilliant round factory. Because fine rate and dependability blemish have same prime cause, because this raises fine rate (lead relevant blemish with fine through decreasing) will raise dependability.

Graph the fine that 2 medium A curves showed a pattern leads a curve. If we consider chip fine rate only, so in a certain moment, make one step of Cheng Zhongjin in thisInvestmentThe likelihood does not have cost effectiveness, because this is led as the elapse fine of time,tend smooth. Graph the curve that 2 medium B dotted line showed the same plant that makes same product. But, if they want to offer money for automobile industry, so the cost that they also must be not worth considering dependability. Below this kind of circumstance, need is fartherInvestmentWill reduce blemish density further, this can raise fine rate already, can promote car supplier wants reliability again.

Graph the yield curve of round factory of brilliant of 2 different types (yield is opposite at time) . A curve applies to the brilliant round factory that is not auto industry, what basically consider is the gain ability of brilliant round factory. In some hour, yield is already enough tall, continue to try bring down ratio of defects is not actual. B dotted line also is the yield curve that included dependability. To the carSupply chainThe integrated circuit product that uses in, must have additional investment, in order to ensure Gao Ke relies on a gender, closely related this and accrual.
The pattern that becomes car supplier to need brilliant round factory to run the level by transition of supplier of average level chip transforms. Manufacturer of successful automobile industry semiconductor adopts the following strategy already: Reduce potential (dependability) the optimal method of blemish is the level of overall and random blemish that reduces brilliant round plant. This means the strategy that should have a world’s top-ranking bring down drawback, include: Base lineFine leads promotion, the bring down is unusual occurence rate, appear unusual when can discover online rehabilitate quickly, and use grain chooses the grain with doubtful eliminate.

(Article author is David W. Dr. Price and Jay Rathert are the senior inspector general of KLA-Tencor company. Douglas Sutherland is the chief scientist of KLA-Tencor company. Came 15 years in the past, they cooperate with manufacturer of many 50 semiconductor IC directly, they optimize whole in the light of all sorts of specific marketsCraftControl is politic, include car dependability, cost of traditional brilliant round plant and risk are optimized, and those who be aimed at advanced design standard is optimal appear on the market method. )