Dialog vice-president John Teegen: GreenPAK platform enhances cost effectiveness

Dialog vice-president John Teegen: GreenPAK platform enhances cost effectiveness

Case of Dai Le of supplier of technology of as changeover of power source of power source management, AC-DC, low as blue tooth power comsumption (Dialog) announces his but IC(Configurable Mixed-signal IC of mark of configuration mixture question, CMIC) shipment volume already broke through 3.5 billion. This one new record drives an element to come from the CMIC technology of Dialog rear, can let design an engineer to develop new electron simply quicklyProduct. Dialog already rolled out a series of development tool platform, further support uses the architect of GreenPAK SLG46826 and SLG46824 CMIC.

DialogVice-presidentJohn Teegen expresses, the main ability of GreenPAK is integrated report source control and digital function, this also is the way that Dialog runs for a long time. GreenPAK is integrated the soft hardware that development needs and silicon brilliant component, assist a manufacturer to design new package their terminal quicklyProduct, bring biggerCostBenefit. Teegen is compensatory, the settle or live in a strange place that can make the dissimilation that have difference more quickly makes GreenPAK change a design, the loop that and can let circuit board goes up amount of more compact, component is fewer, achieve then reduceCostpurpose. GreenPAK can offer disperse type to design the development rate that achieves hard and flexibility, assist a manufacturer to shorten appear on the market time.



DialogVice-presidentJohn Teegen expresses, the main ability of GreenPAK is integrated report source control and digital function, this also is the way that Dialog runs for a long time.
Share 5 support to develop platform now, the engineer that ensures use GreenPAK develops electronic product has the richest choice.

The platform of 3 old key members of GreenPAK tool, include DIP Development Platform, Advanced Development Platform and Pro Development Platform, supportable SLG46826 and SLG46824.

Spice Simulation Platform already began to supply, supportable SLG46826 and SLG46824, also combine the GreenPAK Designer Software of free download. In-System Programming Board develops platform to support In-System Debug(ISD) and In-System Programming (ISP) .

SLG46826 and SLG46824 GPAK areThe marketThe first uses simple I2C serial interface in order to support the CMIC product of ISP. Can cut development program, can install a GreenPAK component that did not configure at circuit board, and support is not volatile memory (the In-System configuration of NVM) , simplify the system detects. Although be inProductionThe environment also can apply this adequately to design flexibility, can be in directlyProductionOnline configuration is not volatile memory, so that can be repaired easily,change the configuration of package or increase a function.


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