How is MLCC to resist the thermal shock in wave crest solder?

How is MLCC to resist the thermal shock in wave crest solder?

[introduction] when be heated quickly when component inside short time or cooling, can produce a large number of heat to hand in , this component gets likely thermal shock, cause rupture of cell machinery sex possibly.
How is MLCC to resist the thermal shock in wave crest solder?  
 
Wave Yi solder is the common welder in process of PCB Jian outfit art.
 
When component is heated quickly inside short time or cooling, can produce a large number of heat to hand in , this component gets likely thermal shock, cause rupture of cell machinery sex possibly.
 
Wave crest solder needs commonly very tall conduct heat rate, inside very short time environmental temperature has very big change, if heat incorrectly or cooling, this component produces visible micro-crack easily. These micro-crack can pass the structural dilate of component itself, disconnect possibly, cause intermittence or too big discharge leakage current.
 
In multilayer capacitor of pottery and porcelain (MLCC) be a kind get very easily the commonly used component of thermal shock. To reduce this problem, PCB can pass area of a warm-up first before entering wave crest chamfer, it can help the MLCC on PCB promote place needed temperature, the quick temperature that avoids to cause thermal shock changes. Please advertent every component has to designate warm-up area solder limits.
 
Besides, when solder is fused, place in component solder dish the redundant solder that go up will produce more quantity of heat to deliver component. In process of solder of peak of Zuo travelling wave, use just it is crucial that enough solder will solder. If the surface sticks outfit solder dish on have too much solder, this creates thermal shock possibly also. The solder that you may need an examination to be being used creams the ply of pattern plate, ensure did not place overmuch solder.
 
 
 
 

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