3D-IC of chip of much nakedder brilliant encloses TSMC of support of Design Platform of new Cisco ability technology
[introduction] new Cisco ability announces, design Platform of new Cisco ability supports TSMC WoW in the round direct pile and CoWoS® are advanced enclose a technology. Design Platform support and photograph of 3D IC referenced flow are united in wedlock, help user is in the application such as communication of mobile computation, network, consumption and car electron deploy joins high-poweredly, high chip of much nakedder brilliant technology. New Cisco ability (Synopsys, inc. ) announce, design Platform of new Cisco…