[introduction] want to ensure the dependability of integrated circuit, be necessary to know enclosed hot character. Should written guarantee parts of an apparatus lukewarm maintain in what allow the biggest be restricted to be worth the following, integrated circuit must can come loose effectively through enclosing hot. Integrated circuit encloses heat to emulate conduce to forecast a knot to enclose thermal resistance blandly, help thereby optimize hot property in order to satisfy specific requirement.

The article wants a place

• Want accurate the ties that forecasts integrated circuit to enclose is friendly thermal resistance, optimize then medicinal powder hot property, emulated action holds the balance.

• Should come true efficient conduct heat, JC of the JA of thermal resistance Θ that must understand and manages integrated circuit to enclose, Θ and Θ JB.

Want to ensure the dependability of integrated circuit, be necessary to know enclosed hot character. Should written guarantee parts of an apparatus lukewarm maintain in what allow the biggest be restricted to be worth the following, integrated circuit must can come loose effectively through enclosing hot. Integrated circuit encloses heat to emulate conduce to forecast a knot to enclose thermal resistance blandly, help thereby optimize hot property in order to satisfy specific requirement.

Integrated circuit encloses hot emulation point

Accurate material attribute

The material heat that ensures to in emulating, be used is characteristic and accurate without by accident, change along with temperature and change.

Overall attrib border condition is installed

The attrib border condition of the setting should be close to real world setting as far as possible, in order to achieve more accurate emulation result.

Bring into mode of practical air current

In wind cold system, want to undertake building a model to mode of practical air current, is not hypothesis ideal condition.

The time domain of dynamic system is analysed

Undertake time domain heats up an analysis, understand the heat that changes along with time to answer, it is especially in dynamic system.

Test and verify of data of a case of a physically strong patient running a high fever or suffering from such disorders as stasis of blood

The data of a case of a physically strong patient running a high fever or suffering from such disorders as stasis of blood that uses physical prototype as far as possible comes test and verify emulates a result.

Integrated circuit encloses transistor heat to emulate

The measure that integrated circuit encloses hot emulation technological process (give typical examples)

Establish three-dimensional model

Include naked piece, line of substrate, bond, enclose material and enclose main body, and any exterior bring foot, sheet metal or other and necessary radiator.

Determine emulated material parameter and attrib border condition

Heat emulates medium crucial material parameter to include specific heat and hot conductivity. These attribute and temperature are concerned, need is defined carefully in order to ensure accuracy.

Attrib border condition is crucial, because they decided the temperature of model brim and quantity of heat,deliver. These border can be hot heavy border, use at coming loose to heat up, also can be hot adiabatic border. Be airy circumstance falls all round the model, airy existence and flow become the main factor that affects whole model temperature badly to distributing.

Decide and analyse the temperature that changes along with time to distributing

Besides deciding final temperature or dormant temperature, the circumstance that analytic temperature distributings to change along with time also can be emulated for heat provide more inspiration. For example, when the emulation that undertakes is based on time to enclosing parts of an apparatus, can observe the temperature inside 100 millisecond distributings. This kind of emulation that is based on time offerred two perspectives:

• Quantity of heat basically comes from heat source, inside original 100 millisecond, according to enclosed thermal resistance, calorific likelihood is a kind of local phenomenon, spread possibly also the other part of circuit board.

• Through cent analyse can understand quantity of heat to transmit directional current, and different parts of an apparatus and material the action with here medium process. For example, bond line may cause very big effect, and the moulding that serves as dielectric won’t change the temperature inside initiative time possibly to distributing significantly.

This kind emulate what be based on time in detail kinetic to understanding the heat inside parts of an apparatus crucial.

The parts of an apparatus that pays close attention to mainly answers when emulating

1. is naked piece

It is naked that most integrated circuit encloses medium heat source piece, naked piece material attribute and calorific character are emulated core

2. bond line

Bond line often is ignored, but it has major effect to enclosing the heat inside to distributing

3. encloses moulding

Enclose the action that dielectric reachs since moulding, the hot character of material and ply are hot to coming loose have main effect

4. down-lead and solder are nodded

Down-lead and solder dot are the less important route that quantity of heat delivers PCB, meeting influence whole heats up function

Thermal resistance

The management of quantity of heat in semiconductor almost with thermal resistance (normally with ” θ ” express) direct and relevant, thermal resistance is to describe material to conduct heat characteristic crucial index. Integrated circuit (the capacity that the thermal resistance that IC) encloses uses at quantifying the quantity of heat that produces IC to deliver circuit board or surroundings. After the temperature that gives two differentia, need to be able to determine these two heat flow between the dot accurately according to thermal resistance value only.

Integrated circuit encloses thermal resistance variable to analyse —

Enclose hot emulation demand to satisfy all sorts of integrated circuit, cadence Celsius Thermal Solver encloses heat to emulate for integrated circuit offerred comprehensive solution. It uses a course to produce the large-scale collateral framework of test and verify, faster than traditional solution performance can be provided below the situation that does not affect accuracy.

Article origin: Cadence model ascend PCB to reach enclose resource center

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