Quicken car electrification: Release the force that encloses innovation
[introduction]The traditional car photograph that we know to with most person the place in growing process is taken is compared, today’s car is close to the electronic product on wheel more — although we once were opposite,the in-house work below its engine lid and control feel exclaim, but contemporary car already the computer its thicken. In recent years, as the design personnel is sought reduce weight, raise dependability, simplify car is assembled, function of creation poor dissimilation and carry out assist and drive advancedly automatic system, the continual electrification that we see continues outspread to whole vehicle, what did system of transmission of prep let alone produce.
The traditional car photograph that we know to with most person the place in growing process is taken is compared, today’s car is close to the electronic product on wheel more — although we once were opposite,the in-house work below its engine lid and control feel exclaim, but contemporary car already the computer its thicken. In recent years, as the design personnel is sought reduce weight, raise dependability, simplify car is assembled, function of creation poor dissimilation and carry out assist and drive advancedly automatic system, the continual electrification that we see continues outspread to whole vehicle, what did system of transmission of prep let alone produce.
In this one trend at the beginning of, when electrification is confined to certain car function, the control method that is based on region appears very significant. However, as the addition of the addition of software amount and software breakdown risk, can upgrade to software unit demand becomes apparent. The complexity that various ECU combination bring is farther aggravate challenge, carry out almost impossibly upgrade effectively. This brought about numerous electron to control unit (of ECU) compositive, in order to handle patulous function, bring about certain car to contain this kinds of many 100 module thereby. Although the space is very limited, but they need to install a certain position in car structure. Wiring also becomes complex with ponderosity, with reduce weight and the target that raise dependability to run in the opposite direction.
Nowadays, more and more car functions by special ECU place compositive, this kind of divisional framework is very popular nowadays, can reduce ECU amount and simplify wiring, frameworks of all sorts of this kind of functional aggregate ECU can reduce cost. However, like any project challenges, have so that have surely break, in entering a variety of different function conformity fewer ECU, may make its become too giant, ponderosity and bad news report, we do not wish naturally to compromise.
From distributed the development to framework of E/E of contemporary car section
The power semiconductor in car infrastructure
Engineer and the traditional method that devise personnel to had drawn lessons from electronic industry answer this one challenge: Raise semiconductor compositive spend and use complex multilayer underlay with contractible component span, reduce the size of PCB and equipment thereby.
However, of additional circuit join also push the typical power requirement that raised every ECU. Because the space is limited, power source circuit must smaller, and the power of processing is greater however, this increased power density, ask to increase medicinal powder hot, in order to prevent overheat and ECU inchoate breakdown.
In other industry, design personnel uses advanced power source quickly to change develop to attack structure, use synchronism to rectification and the technology such as 0 voltage switch improve efficiency and decrease medicinal powder hot. However, in car domain, the element such as cost, dependability, durable sex holds dominant position, design personnel often apt adopts more conservative, more mature plan, be like asynchronous step-down, step up and SEPIC converter. Accordingly, although the pressure of power density makes component supplier leave,send the enclosing with a smaller size, but of component medicinal powder quantity of heat must keep changeless.
Transistor and rectification diode need new-style semiconductor to enclose, save a space already, have extremely tall thermal efficiency again. In a lot of acting products, design personnel relies on SOT23 and SMx all the time (SMA, SMB, SMC) wait to enclose means existingly, but the fast iteration as demand, be badly in need of coming loose at present heat energy force is more powerful new-style enclose.
Ground floor innovates: New generation is enclosed how to come true efficient medicinal powder hot
But, what is the adversary that new generation encloses? SOT23 is the transistor with the most commonly used all trades and professions and diode surface are stuck outfit enclose one of, type of this kind of down-lead is enclosed will naked a join go up to down-lead frame, receive source pole repeatedly directly normally, and solder line joins grid is mixed on leakage pole down-lead. And just as its name implies, DFN (schism is compressed without down-lead) the structure does not contain down-lead, its bottom uses terminal of double platoon wiring, span is very close, can shorten solder line,
Reduce thereby enclose inductance, without naked piece enclose resistor (DFPR) and thermal resistance, improve electric performance. In existing SOT23, the quantity of heat of internal generation must be passed naked piece stick receive a layer to arrive at down-lead frame, arrive at underlay along source down-lead, under photograph comparing, more advanced DFN can conduct quantity of heat downward directly from chip to what enclose bottom source pole solder dish, shorter way can ensure more efficient medicinal powder hot.
The inside view that SOT23 and DFN enclose and medicinal powder hot method
Power diode can carry a large number of electricity in switch transition, because the design personnel hope of this power circuit improves his,come loose hot property. SMx encloses the first selection that coming for years is design personnel all the time, giving place to gradually now copper is placed piece (CFP) new-style enclose. Compare with the SMx photograph of similar rating, CFP encloses the PCB area that can save 38-75% , have at the same time coequal or more the power of actor handles ability. It is an unit with W/cm2, medicinal powder heat energy force promotes considerably.
CFP encloses the rises to basically be attributed to us copper of function to place a technology, this technology can replace traditional solder line technique. 20 old before, we roll out nondestructive to enclose LFPAK first and promote this one technology to the market, this one major innovation makes experienced circuit design personnel fab, they are open-eyed at this one small-sized the mighty power that encloses place to have handles ability, and the key of this one technology depends on can enhancing chip coping and bottom to come loose the copper of hot effect is placed piece. With common solder thread join photograph is compared, coping connective surface is accumulated bigger, arrive from chip of PCB medicinal powder hot way is shorter, and clip piece area of large cross section can ensure quantity of heat is conducted effectively to enclose bottom and underlay.
Copper is placed piece enclose (the view inside CFP)
Minor volume, improve greatly: CFP and DFN provide sexual price to compare more
Current, car application domain asks generally to save efficiency of space, high fever enclose, include system of inverter of LED lighting system, drawing, batteries management (BMS) and high-power car carry charger (OBC) . DFN will make small signal diode and the first selection plan of transistor, future, what CFP also will make power diode is optimal enclose means. This kind of change is occurrent, we had begun investment to improve productivity.
We are pressing need encloses a type newly. The computational ability of contemporary car rises ceaselessly, also need to bring a foot to count more MCU, because this is multilayer,PCB is the precondition of correct wiring. The cost of these PCB is higher, because this need makes,appliance has the lesser dimension of identical and electric function to enclose. Although small-sized enclose a solution to may raise spare parts cost, but of systematic cost reduce what will prove using CFP and DFN to enclose is advisable to choose.
Nevertheless, below a lot of circumstances, small-sized enclose itself to be able to reduce spare parts cost. Product line already proved this kind is enclosed provide cost effectiveness more, because enclose cost and enclose dimension to become inverse ratio. We see, CFP is enclosed in the tradition such as SMx of excel of manufacturing cost respect, DPAK, TOx to enclose means, we forecast DFN to enclose also is such.
Contemporary car and the requirement that industry uses constant growth promote the development of component market, mix to the price supply produced an effect. Demand will exceed SMA, SMB, SMC to wait ” traditional ” enclosed supply and usability, this will force design personnel to use property more the replacement scheme of actor, in order to get used to the demand of prospective product.
Summary
Nowadays, electronic product market calls smaller, more powerful, more reliable car ECU, fortunately newest efficient enclose a technology to make all these becomes a possibility, reduced the size of power transistor and power diode greatly, promoted at the same time medicinal powder hot.
Nexperia will continue to invest energetically expand produce can, with satisfying the market demand that increases increasingly, especially the demand that car and industrial application domain enclose a product to CFP and DFN. Push through the parts of an apparatus a variety of version to the market, we emphasized expanding produce can, accelerate to bulk more Xiaohe optimizes hot property to enclose transferring acceptance.
(author: Frank Matschullat, the semiconductor that bring a life)
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