[introduction] brought about inverter new inverter to design a requirement to electric machinery from control ark move. What ask among them is heat management. Inverter of standard cabinet form moves in quite friendly environment, protect a requirement without special IP, differ with electric machinery, electric machinery installs the position that stands by the goods that machining in product line. Under photograph comparing, embedded driver uses in-house inverter, this requirement electric machinery and inverter are waterproof, dustproof, affect hot performance of the system thereby.

Brought about inverter new inverter to design a requirement to electric machinery from control ark move. What ask among them is heat management. Inverter of standard cabinet form moves in quite friendly environment, protect a requirement without special IP, differ with electric machinery, electric machinery installs the position that stands by the goods that machining in product line. Under photograph comparing, embedded driver uses in-house inverter, this requirement electric machinery and inverter are waterproof, dustproof, affect hot performance of the system thereby.

In IP65 protection system, the dissipation power of all component can pass its surface only (basically be radiator) eduction. Accordingly, embedded the design of the inverter that uses in the system must limit ground reduces power comsumption, use good hot interface to join component of all power comsumption radiator. Maintain integral temperature inferior prevent systematic interior occurrence heat, can ensure whole fastens the dependability of all.

Graph 1.  Develop of CI + PFC attacks. The picture is offerred by system of rich much power [PDF]

In addition, inverter must enough small in order to suit given environment, realize compact electric machinery design and tall installation density thereby. For example water treatment, hot pump and ventilated system. Systematic surface accumulates decrease make optimize heat management to become more important. In the meantime, bulk of contractible whole system needs intelligent system to break up, limit ground reduces power share, store can mix between inverter control plate interrelate.

The inverter class that the collective requirement of all application is rectification diode, passive or active PFC and electric machinery, if pursue,1 is shown. The PFC circuit with additional need will satisfy what made 2012 can effect instruction, have the application of the following function in order to develop: Taller efficiency.

Graph 2 showed embedded two application of driver, showed the compact sex that compositive inverter realizes.

Graph 2. As embedded the Wilo pump of drive system give typical examples and Ebm-papst fan. The picture is offerred by system of rich much power [PDF]

The component that the challenge depends on will having distance climbing report and clearance demand (a large number of spaces on need PCB) shift arrives the reposition of applicable and other regulation. These component include the part such as capacitor of semiconductor of CI + PFC and bootstrap circuit, spreader, amortize. This is the place of action of play of power source module. Normally fill has power source module electric insulation silica gel, interpose report intensity is every millimeter thousands of bend over. Enclothe package to be able to make they are enclosed more closely with silica gel.

Among them an obstacle is the distance between two orbit, when use standard Al2O3 DCB, this distance needs > 0.5 Mm. Naked to power semiconductor piece for, this is not a problem, but to resistor, capacitor and the discrete element such as diode, this becomes have challenge sex more, more such to IC. Below these circumstances, the thick film technology of Vincotech offerred the solution that has an outlook, can realize the fine span that is less than 0.5 millimeter.

Vincotech is embedded the module that drive application provides two kinds of kinds: The DCB module that contains power semiconductor only and the thick film module that still contain active and passive element. Although both is based on alumina, but their main distinction depends on base material ply and whether do two side have cupreous plane. Because Al2O3 is a kind of brittle material, need tread lightly, double what be DCB about because of the ply of substrate of this thick film, it is 1 millimeter about. In addition, they have taller thermal resistance, because of coping and bottom copper be short of break do not allow thermal diffusion.

Thick film module is based on a kind of technology, this technology allows to presswork on alumina substrate different layer, finish fire in C of 850 ° next. All sorts of oar makings can be used at different utility, lead conductor of orbital low ohm and resistor oar makings with Yu Gaogong for example, limits arrives from the low cost that is used at spreader the high cost that is used within the M Ω limits of all sorts of resistor functions.

Resistor of laser fine tuning can raise its precision, and add vitreous passivation layer to be able to raise its dependability.

Graph 3. The module that is based on DCB quite (left) with thick film module (right) . The picture is offerred by system of rich much power [PDF]

Next graphs were described compositive the component in thick film module. Above all, differ with the circumstance of module of standard power source, the implementation of IC includes grid drive diode, resistor and capacitor (this kind of situation is very unusual) . , with grid resistor and grid – blast off extremely capacitance is exemple. Product of other Vincotech thick film is had different open and shut grid resistor, and optional grid blasts off extremely resistor, fall to undertake discharging to grid with the circumstance that does not have power source at be in.

Graph 4. The in-house circuit of module of thick film power source. The picture is offerred by system of rich much power [PDF]

Graph 5. Do not use Cge (left) and use compositive Cge (right) EMI is measured. The picture is offerred by system of rich much power [PDF]

This circuit still includes circuit of a PFC, this circuit has fast 650 V IGBT or faster Si MOSFET and fast Si diode, when perhaps should needing taller switch frequency and efficiency, still include SiC diode.

The capacitor of pottery and porcelain between DC+ and DC- closes the road of high frequency annulus inside power source circuit. Grid and blast off extremely the capacitor between improved EMI further, if pursue,5 are shown.

The placement of capacitor can produce very big effect to measured value.

 

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